1. Thermodynamic repair technology, using heat conduction, thermal blankets, thermal wells or hot walls, or heat radiation, radio wave heating, etc. to achieve the repair of contaminated soil.
2. Thermal desorption repair technology, heating the soil contaminated with organic matter above the boiling point of organic matter by heating, so that the organic matter in the adsorbed soil is volatilized to a gaseous state and then separated.
3. Landfill method, using waste as a kind of mud, adjusting the nutrition, humidity and pH of the soil by fertilizing, irrigating, adding lime, etc. Maintaining aerobic degradation of pollutants in the upper layer of the soil.
4. Chemical leaching. With the help of chemical / biochemical solvents that can promote the dissolution or migration of pollutants in the soil environment, the eluent is injected into the contaminated soil layer under the action of gravity or by head pressure, and then contains the pollution The solution of the substance is extracted from the soil, and the technology of separation and sewage treatment is performed.
5. Phytoremediation, using agricultural technology to improve the chemical and physical constraints of soil that are not good for plant growth, making it suitable for planting, and directly or indirectly absorbing, volatilizing, separating, and degrading by planting preferred plants and their rhizosphere microorganism Pollutants, restoration and reconstruction of natural ecological environment and vegetation landscape.
6. Bioremediation, a controlled or spontaneous process that uses organisms, especially microorganisms, to catalyze the degradation of organic pollutants, thereby repairing the polluted environment or eliminating pollutants in the environment. Among them, microbial repair technology uses microorganisms, indigenous bacteria, foreign bacteria, and genetically engineered bacteria to transform and degrade pollutants, and is mainly used for the degradation of organic pollutants in soil. By changing various environmental conditions, such as nutrition, redox potential, and co-metabolic substrates, microbial degradation is enhanced to achieve governance goals.
7. Physical remediation technology, which mainly uses the differences in physical properties between pollutants and soil particles, and between polluted soil particles and non-polluted soil particles, to achieve the purpose of removing and separating pollutants from the soil, mainly including soil replacement. Method, thermal repair method, vitrification repair technology and point dynamics repair method.
(1) The soil replacement method is a method of diluting the original pollutant concentration and increasing the soil environmental capacity, thereby achieving soil pollution repair. The thermal repair method is a method of heating the contaminated soil so that the volatile pollutants in the soil can be collected for recycling or treatment when the soil is volatile.
(2) Vitrification repair technology refers to the use of thermal energy or under high temperature and pressure conditions to melt the contaminated soil to form a glassy substance, to fix the pollutants therein, to achieve the purpose of eliminating pollution. Electrokinetic repair is a method that uses solvent electroosmosis and solute electrophoresis to orient heavy metals or organic pollutants to an enrichment chamber near an electrode, thereby enabling soil repair.
8. Chemical repair methods can be divided into in situ chemical repair and ectopic chemical repair. In situ chemical repair refers to the addition of chemical repair agents on the site of contaminated soil to degrade pollutants or remove the toxicity of pollutants through chemical transformation mechanisms, and chemically fix pollutants to reduce their activity or biological effectiveness. method. Ex-situ chemical repair is mainly a method of converting pollutants in the soil into a liquid form through a series of chemical processes, or even through enrichment, and then sending these liquid substances containing the pollutants to a special processing place for processing.